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Professional Solution Provider for Various Industrial Applications.
Today, Xiaobian to introduce the BGA repair platform, hope to help you ~BGA is a chip packaging technology. BGA chip repair equipment called BGA repair table, repair range includes all kinds of packaging chips. BGA improves the performance of digital products and reduces the volume of products through the ball-grid array structure. All the digital products through this packaging technology have the common characteristics of small size, strong performance, low cost and strong function. BGA repair table is a machine used to repair BGA chips. When a chip problem is found and must be repaired, it is necessary to use BGA repair table for repair. That's what the BGA repair table does.
Let's take a look at the advantages of BGA repair platform. First of all, the success rate of repair is high. At present, the success rate of the new generation of optical counterpoint BGA repair table launched by our company can reach when repairing BGA. Now the mainstream heating methods are full infrared, full hot air and two hot air one infrared, domestic BGA repair table heating method is generally hot air up and down, the bottom infrared preheating three temperature areas (two temperature area BGA repair table only upper hot air with the bottom preheating, relative to the three temperature area is lagging behind). Our company mainly uses this heating method. The upper and lower heating heads are heated by heating wires and the hot air is exported by air flow. The bottom preheating can be divided into dark red external heating pipe, infrared heating plate or infrared light wave heating plate to heat the whole PCB board.
The second is simple operation. Use BGA repair platform to repair BGA, you can change the BGA repair master in seconds. Simple upper and lower heating: heat through hot air, and use the air nozzle to control the hot air. The heat is concentrated on the BGA to prevent damage to the surrounding components. And through the convection of hot air, can effectively reduce the probability of deformation of the board. In fact, this part is the equivalent of a heat gun with an air nozzle, but the temperature of the BGA repair table can be adjusted according to the set temperature curve. Bottom preheating plate: it plays a preheating role to remove the moisture inside PCB and BGA, and can effectively reduce the temperature difference between the heating center and the surrounding point, and reduce the probability of deformation of the board.
BGA repair table operation panel
Then is the clamping fixture of PCB board and the lower PCB support frame, this part of the PCB board plays a fixed and supporting role, to prevent the deformation of the board plays an important role. Optical alignment through the screen, as well as automatic welding and automatic welding and other functions. Under normal conditions, it is difficult to weld BGA by heating alone. The most important thing is to heat and weld according to the temperature curve. This is also the key difference between using BGA repair table and heat gun to dismantle and weld BGA. At present, most BGA repair tables can be repaired directly by setting the temperature. Although the heat gun can control the temperature, it cannot directly observe the real-time temperature. Sometimes, it is easy to directly burn the BGA if it is overheated.
Fourth, the use of BGA repair table is not easy to damage the BGA chip and PCB board. As we all know, high temperature heating is required when repairing BGA. At this time, the precision of temperature control is very high. A slight error may lead to the scrap of BGA chip and PCB board. The temperature control precision of the BGA repair table can be within 2 degrees, so as to ensure that the chip is intact in the process of repairing the BGA chip, which is also one of the functions of the heat gun can not be compared. The final core of our success in repairing BGA is the temperature and deformation of the board surrounding the repair, which are the key technical issues. The machine avoids human influence factors to a large extent, so that the success rate of repair can be improved and kept stable.
BGA repair table chip fixing device
Fifth, the BGA repair table can not make the solder flow to other pads, to achieve a symmetrical size of the welding ball. After washing the bga, it can be aligned and attached to the pcb, and then flow again. At this point, the component is repaired. It is necessary to point out that the acceptance of manual washing pad is not timely and thorough removal of impurities. Therefore, it is recommended that you choose fully automatic BGA repair table when you buy BGA repair table, which can save you most of the time, personnel costs and money. Although the price is relatively high in the purchase of fully automatic BGA repair table, the repair efficiency and performance are incomparable to manual BGA repair table, so please do a good job of evaluation and comparison before you buy.
Above is a small series for you to introduce the role of BGA repair platform. BGA repair table is mainly used for repairing BGA chips. If you want to know more about the role of BGA repair table or need to consult a BGA repair table with high repair yield, you can search Datafeng.
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Founded in March 2009, Shenzhen Dataifeng Technology Co., Ltd.
