The working principle of the BGA anti-repair table is the same as that of the reflow soldering, which is divided into four stages: preheating, constant temperature, soldering and cooling. Setting the curve of the BGA rework equipment mainly focuses on the temperature when the melting point of BGA is tested. Here is the temperature curve setting of the rework equipment of Dataifeng Technology, hoping to help you.1. Fix the board to be desoldered on the support frame of the BGA rework table.2. Select the appropriate air nozzle, and the air nozzle shall completely cover the BGA chip.3. Plug the plug end of the temperature measuring line into the temperature measuring interface of the BGA rework station, and plug the temperature measuring head at the other end into the bottom of the BGA chip. (If it is a scrap board, you can punch holes in the bottom of the BGA and bury them in the bottom so that the test is more accurate.)4. Set the temperature5. Start the machine, test the temperature, and prepare a pair of tweezers. First of all, the melting point of lead is 183 degrees, and the melting point of lead-free is 217 degrees. During the test, we can also measure whether the board is leaded or lead-free.6. When the surface temperature reaches 215 degrees, continuously touch the chip with tweezers. Be careful to be light. If the tweezers touch the chip, they can move slightly, then the melting point of the chip will be reached. At this time, you can see how many degrees the external temperature is.7. Modify the curve. After knowing the melting point of the chip, you can modify it on the basis of the original curve. When you touch the BGA chip with tweezers, it is its melting point. This is set to a higher temperature for welding, and the time is set to about 25 seconds.
The above is the curve for setting adjustment without knowing whether there is lead or not. If you know whether the board is leaded or lead-free, you can directly look at the temperature of the temperature measuring line. When the actual temperature of lead reaches 183 degrees, the temperature of the BGA surface is set to a higher temperature. When the actual temperature of lead-free reaches 217 degrees, the BGA surface temperature is set to a higher temperature.
Summary: The temperature of the melting point of BGA is related to many factors, such as:
1, BGA packaging, iron shell will be higher than the ordinary packaging temperature, because the iron shell will absorb heat, heat dissipation quickly.
2. The thickness of the board, the thicker the board, the higher the temperature, and vice versa.
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