Using the BGA rework station can be roughly divided into three steps: desoldering, mounting, and soldering.All changes remain the same.Take Dataifeng BGA rework table DT-F750 as an example, hoping to play the role of throwing out a brick to attract jade.1. Desoldering.1. Preparation for repair:.For the BGA chip to be repaired, determine the air nozzle and suction nozzle to be used...The rework temperature is determined according to the leaded and lead-free solder used by the customer, because the melting point of leaded solder ball is generally 183 ℃, while the melting point of lead-free solder ball is generally about 217 ℃...The PCB is fixed on the BGA rework platform, and the laser red dot is positioned at the center of the BGA chip.Roll down the mounting head to determine the mounting height..2 Set the desoldering temperature and store it so that it can be called directly when repairing later.In general, the temperature of desoldering and soldering can be set to the same group.3. Switch to the removal mode on the touch screen interface, click the repair button, and the heating head will automatically come down to heat the BGA chip.4. Five seconds before the end of the temperature, the machine will give an alarm and make a dripping sound.After the temperature curve is completed, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck the BGA up to the initial position.The operator can connect the BGA chip with the material box.The desoldering is completed
Swallow 8:27:33 II. Mounting and welding.1. Use a new BGA chip or a BGA chip with ball placement after tin removal on the pad.Fix the PCB main board.Place the BGA to be soldered approximately at the location of the pad.2. Switch to the mounting mode, click the start button, the mounting head will move downward, and the suction nozzle will automatically suck up the BGA chip to the initial position.3. Open the optical alignment lens, adjust the micrometer, adjust the front, back, left and right of the PCB board in X axis and Y axis, and adjust the angle of BGA in R angle.Both the solder balls on the BGA (blue) and the solder joints on the pads (yellow) can be shown in different colors on the display.When the solder ball is completely overlapped with the solder joint, click the "Alignment Complete" key on the touch screen.4. The mounting head will automatically descend, put the BGA on the pad, automatically close the vacuum, and then the mouth will automatically rise 2 ~ 3mm, and then heat.When the temperature curve is completed, the heating head will automatically rise to the initial position.Welding is complete.Swallow 8:28:03 III. Welding.This function is aimed at BGA with poor soldering due to low temperature in the front, which can be heated again.1. Fix the PCB on the rework platform, and position the laser red dot at the center of the BGA chip.2. Call the temperature, switch to the welding mode, and click Start. At this time, the heating head will automatically descend. After touching the BGA chip, it will automatically rise by 2 ~ 3mm and stop, and then heat.3. After the temperature curve is completed, the heating head will automatically rise to the initial position.Welding is complete.