Today, Xiaobian tells you about the use of BGA rework table. I hope it will be beneficial to you. Step 1: Select the corresponding air nozzle and suction nozzle.Find out whether the reworked chip contains lead and set the corresponding temperature curve. The melting point of the lead-containing solder ball is 183 ℃, and the melting point of the lead-free solder ball is about 217 ℃.Fix the PCB mainboard to be repaired on the BGA rework table, position the laser red dot at the center of the BGA chip, and then shake down the mounting head to determine the mounting height.Step 2: Set the desoldering temperature and store it so that it can be called directly when repairing later.In general, the temperature for desoldering and soldering can be set to the same group.Then switch to the removal mode on the touch screen interface, click the repair button, and the heating head will automatically come down to heat the BGA chip.Step 3: After the temperature curve is completed, the machine will give an alarm and make a dripping sound. At the same time, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck the BGA and automatically place it in the material box. At this point, the desoldering work of the damaged BGA chip is completed.And step 4, aft that tin removal on the bonding pad is finis, using a new BGA chip or a BGA chip subjected to ball planting.Fix the PCB main board.Place the BGA to be soldered approximately at the location of the pad.Switch to the mounting mode, click the start button, the mounting head will move downward, and the suction nozzle will automatically suck up the BGA chip to the initial position.Step 5: BGA solder ball welding, set the welding temperature of the heating table (about 230 ℃ with lead and about 250 ℃ without lead), open the optical alignment lens, adjust the X axis and Y axis to adjust the PCB board from front to back and from left to right, adjust the angle of BGA by R angle until the solder ball is completely overlapped with the solder joint, and then click the "alignment completion key" on the touch screen.The mounting head will automatically descend to place the BGA on the pad, and the nozzle will automatically rise 2 ~ 3mm before heating.When the temperature curve is completed, the heating head will automatically rise to the initial position, and the welding is completed.Step 6: Under normal circumstances, the repair of the BGA chip can be completed after the completion of the above five steps, but sometimes it is unavoidable that re-soldering is required. At this time, it is necessary to place the PCB on the workbench, apply a proper layer of soldering paste on the bonding pad with a brush, align and mount the BGA on the PCB, and basically overlap the BGA bonding pad with the PCB bonding pad.Note that the direction mark on the BGA surface should correspond to the PCB silk-screen frame line direction mark to prevent the BGA from being placed in the opposite direction.While the solder ball is melting and soldering, the tension between the solder joints will produce a certain self-centering effect. Finally, apply the temperature curve of desoldering and click soldering.After heating and automatic cooling, it can be removed and repaired.So the above six steps are about the introduction of how to use the BGA rework table. Have you learned it?