X-ray detection equipment uses cathode electrons to decelerate suddenly in the process of collision with metal targets, resulting in energy conversion, and the lost kinetic energy is released in the form of X-ray. X-ray can penetrate materials with different densities, and the energy of penetration is different, so the projected image can show the internal structure of the object to be detected.Detectable items: internal cracks and foreign matter defects of metal materials and parts, plastic materials and parts, electronic components, electronic assemblies, LED components, etc.; analysis of internal displacement of BGA and circuit board, etc.; identification of empty solder, cold solder, short circuit, tin connection, abnormal large and small ball circuits, etc., which can clearly see defects such as BGA solder joints, defects and casting cracks.Internal condition analysis of microelectronic systems and encapsulated components, cables, fixtures, plastic parts.