Wholesale The machine test in the pop chip factory, what is the result of the test? with good price - Dataifeng

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Shenzhen Dataifeng Technology Co., LTD., founded in March 2009, focuses on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production of r & D company. By courtesy of the general customers the support and the joint efforts of all staff, the chip disassembling welding, balls, and repair technology, independent research and development has a number of high-tech intellectual property patent core technology products, taifeng through innovation, full pursuit of the perfect automation electronic chip repair tools and equipment, quality process continuous optimization, With persistent professional technology and high-quality after-sales technical services, to create more customer recognition and support.

Why choose Datafeng: Since 2009, datai Fung has been focusing on customers' BGA welding,BGA repair and BGA ball planting requirements as before, with consistent quality and service. According to different product applications, datai Fung will provide customers with better solutions immediately. We not only provide technical services, but also save labor costs and production costs for customers. Da Tai Fung has been updating its own products and services for many years, and we are making progress every day!

This product win the recognition of the majority of customers, welcome business cooperation and contact.    

Universal stencil kit fixture for CPU GPU BGA EMMC DDR chip. Used for computer motherboard repair, various PCB production Chip production we lding, etc. The three locating pins are closely matched with the top cover, and the chip and the fixing groove ensure the bal | point and the position of the Steel Mesh Hole are precisely aligned. Reflow design--The ball planter has a diversion groove design, which can easi ly pour out the excess solder balls. Chip card slot--users can customize the chip tray according to the chip size. Easy to operate--The operation of fixing the chip in the chip fixing slot is simple and quick. The mold core is separated from the base, easy to replace. Solidity--The four corners of the upper andI ower frames are fixed with the steel mesh to keep the steel mesh flat. The three holes of the lower frame are matched with the pins of the base.

Shenzhen Dataifeng Technology Co., Ltd. started in March 2009, focusing on the production of electronic chip welding technology in SMT production process, integrating research and development, production, sales and service. Thanks to the support of the new and old customers and the joint efforts of all staff, in the chip soldering rework technology, we have a number of core technology products with independent intellectual property rights.Through the pioneering and innovative, the products are continuously improved and the quality continues to improve.Good professional technology and excellent after-sales service have won the recognition and trust of our customers. Welcome new and old customers from all walks of life to contact us for future business.

X-RAY nondestructive detector is a kind of low energy X-ray to detect the object under test quickly, without damaging the object under test.Nondestructive testing is a powerful guarantee to improve product quality and can effectively reduce or avoid accidents caused by defects. As a practical nondestructive testing technology, X-RAY nondestructive testing has been widely used in aviation, oil, steel, machinery, vehicles, fossils, cultural relics and other fields. It can accurately check the internal structure of the workpiece, without damaging the appearance of the object.X-RAY nondestructive testing (NDT) is a technique that uses the absorption difference of the object against the object X-ray material, shows the internal structure of the object, and then examines the internal defects. Widely used in industrial inspection, medical inspection, safety inspection and so on.The application of X-RAY detector in detection has the following characteristics:1. It can be used to check whether there are cracks and foreign bodies in some metal materials and parts, electronic components or light-emitting diode components.2. It can detect and analyze the BGA circuit board internally.3. Check and judge BGA welding, broken wire, air welding and other defects.

The basic types of BGA repair stations are PBGA, CBGA, CCGA and TBGA. Typically, the bottom of the package is connected to the solder ball array as input/output terminals. The typical spacing of the ball arrays in these packages is 1.0 mm, 1.27 mm, and 1.5 mm, respectively.