Product application range
Specific application range of ball planting:
IC: Support SOP，TSOP， TSSOP， QFN and other packages with a minimum pitch
(Pitch) of 0. 3mm; support BGA and CSP packages with a minimum ball
diameter (Ball) of 0. 2mm
Production appl ication range:
Production and manufacturing of mobile phones, communications, LCD TVs, set- top boxes, home theaters, automotive electronics, medical power equi pment, aerospace and other products/ equipment, as well as mass production and processing of general electronic products.
1. Japan Oriental Precision Lifting System. After the chip is planted it will automaticaly rise an fall, can greatly avoid losses.
2. Silver screw guide rail. The friction resistance is low, and the excellent lubrication structure can ensure that the machine maintains the walking accuracy for a long time, the walking is smoother, and the noise is lower.
3. Mean Well Power. Adopting Meanwell power supply, with the characteristics of overheating protection, temperature-controlled fan cooling, no-load loss <0.75 watts, etc, to ensure the efficiency of the ball planter and high fficiency. Long lifespan, 3 years warranty.
4. Zhengtai Power Switch With specific current and voltage ratings, it will be shut down for safety if the current or voltage exceeds the specified.
5. Mitsubishi PLC control system Intuitive and efficient object-oriented graphical user interface, easy to learn and use.
6. Steel mesh fixed fine-tuning structure. Fast positioning, improve the accuracy of planting the ball. Adjust according to different types of steel mesh