bga rework equipment

BGA rework station is used to repair SMT motherboard chips and IC chip repair.Full screen visual maintenance,with advantages of optical alignment and positioning.

High Temperature Sponge for BGA.

Shenzhen Dataifeng Technology Co., Ltd. was founded in March 2009, focusing on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production enterprises.

Automatic high-precision infrared optical alignment bga rework station/bga repair machine for PCBA BGA QFP repair，Touch screen and PLC temperature control automatic system, the whole process of chip repair is visible.

It is a special repair tool, that is, the excess tin that is not cleaned by the soldering iron, which can be cleaned up with a soldering wire, saving rework and repair time.

Lead-Free Solder Wire for BGA.

Shenzhen Dataifeng Technology Co., Ltd. participated in the technical training graduation photo.

Ic chip desoldering, PCBA chip desoldering. Mobile phone, tablet computer, TV, game console chip desoldering repair.

Shenzhen Dataifeng Technology Co., LTD., founded in March 2009, focuses on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production of r & D company. By courtesy of the general customers the support and the joint efforts of all staff, the chip disassembling welding, balls, and repair technology, independent research and development has a number of high-tech intellectual property patent core technology products, taifeng through innovation, full pursuit of the perfect automation electronic chip repair tools and equipment, quality process continuous optimization, With persistent professional technology and high-quality after-sales technical services, to create more customer recognition and support.

STM Patch Process

Celebrating birthdays for colleagues, everyone is very happy and grateful to meet and work together.

861X Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.