bga rework equipment

Universal Stencil for CPU GPU BGA EMMC DDR Chip.

DT-F330 BGA rework station used for circuit board chip desoldering and repairBGA rework station suitable for perfect welding of chips of different sizes and thicknesses.Three temperature zones, independent temperature control, touch screen independent research and development patented system.

STM Patch Process

It is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.

Dataifeng China DT-F210 BGA Semi Balls mounting machine manufacturers - Dataifeng,All products are independently developed, with 2 R&D bases and multiple production lines.

Shenzhen Dataifeng Technology Co., LTD., founded in March 2009, focuses on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production of r & D company. By courtesy of the general customers the support and the joint efforts of all staff, the chip disassembling welding, balls, and repair technology, independent research and development has a number of high-tech intellectual property patent core technology products, taifeng through innovation, full pursuit of the perfect automation electronic chip repair tools and equipment, quality process continuous optimization, With persistent professional technology and high-quality after-sales technical services, to create more customer recognition and support.

Dataifeng Intro to Solder Balls for BGA Dataifeng,Shenzhen Dataifeng Technology Co., Ltd. has more than ten years of research and development experience, has many senior technical engineers, and has applied for many national technology patents and professional inspection certificates in ChinaSolder Balls for BGA.

Dataifeng Best Solder Paste for BGA Supplier,Shenzhen Dataifeng Technology Co., Ltd. has more than ten years of research and development experience, has many senior technical engineers, and has applied for many national technology patents and professional inspection certificates in ChinaSolder Paste for BGA.

861X Hot Air Gun Soldering Station is suitable to the de-soldering of the SMD components,such as SOIC、CHIP、QFP、PLCC、BGA .Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection, glue welding.

Dataifeng Best BGA Special Brush Supplier,All products use high-quality and high-precision imported raw materials (temperature control instrument, PLC, heater).BGA Special Brush.

Dataifeng Best Reballing Chip Fixture for BGA Company - Dataifeng,All products use high-quality and high-precision imported raw materials (temperature control instrument, PLC, heater).Reballing Chip Fixture for BGA.

Shenzhen Dataifeng Technology Co., Ltd. was founded in March 2009, focusing on solving the SMT process of electronic chip welding technology, set research and development, production, sales and service in one of the production enterprises.